REL22 Lead-Free Solder Alloy

REL22 has also been developed to provide PCB designers and assemblers with the most durable alloy option possible. REL22 has demonstrated twice the durability of SAC305 in thermal cycling and mechanical performance. REL22 addresses production quality issues associated with similar alloys including Sn/Ag/Bi/Sb/Ni/Cu, such as pin-holes on SMT solder joints and voiding on BTC components. Testing demonstrates that REL22 is well suited to extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and other severe operating environments. The low creep rates exhibited by REL22 make it ideal for applications where thermal shock, vibration and high g-forces are experienced.