sigmaX 3D SPI

Solder Paste Inspection is an important process to check the solder paste deposited in the assembled PCB manufacturing process. Observation tells us that most of the solder joint defects in a PCB assembly are because of failures in solder paste printing. With the help the SIGMAX solder paste inspection (SPI), our customers can reduce the defects related to soldering considerably.

The SIGMA X has two laser beams that project from opposite directions to eliminate the risk of shadowing. The beams are then scanned onto the PCB and reflected back to a high-resolution camera (CMOS) to calculate height with X-Y spatial resolution. The result is a highly- accurate 3D model construction. This Multiple Profile Correlation (MPC) is a PARMI exclusive, and provides realistic and easy-to-interpret 3D images without distortion.