Xceed 3D AOI

The Parmi Xceed New Generation 3D AOI range of systems can detect all defect types that relate to component placing and soldering. Its high speed CMOS camera with dual-laser technology can easily identify missing, lifted, misaligned and tomb-stoned components as well as check polarity of all devices.

The best in 3D AOI systems. Whether we are helping you increase your PCB yield and throughput, solve a unique challenge, or increase your ROI, Parmi systems give you a competitive edge. Parmi have developed their new generation Xceed 3D AOI to improve your processes and product quality in terms of component placing and soldering quality.