Semi-Automatic Assisted Rework
Max PCB Size: 12 x 18”/300 x 450mmMax Component Size: 2.1 x 2.1”/55 x 55mmMin Component Size: 1 x 1mmComponent Removal: Automatic Component Removal and PlacementComponent Placement: Split Beam Prism Alignment/x50 MagnificationPlacement Accuracy: Up to 10umTop Heater Power: 150W Focused Infrared up to Ø70mm SpotPCB Preheater Power: 2800W Medium-Wave IR (3 Zones)PCB Preheater Heating Area Size: 14.1 x 9.4”/360 x 240mmComponent Temperature Sensing: Non-Contact IR SensorPCB Temperature Sensing: Non-Contact IR SensorNumber of TC Channels: 4
