PARMI Xceed BSI

Bottom Side Inspector optimized for THT Process

‘Xceed BSI’ is a 2D & 3D AOI machine that inspects the bottom side of the PCB without flipping the board after wave or selective soldering. Since it is not necessary to flip the PCB, it eliminates unnecessary handling of the PCB and minimizes the footprint of the line. The main uses of the machine are to inspect the condition of the pins and solder joints after soldering of THD components. ‘Xceed BSI’ can also be used for general SMD components inspection on the bottom side of the PCB.